TK40F08K3 2010-02-23 1 toshiba field effect transistor s ilicon n channel mos type (u-mosiv) TK40F08K3 swiching regulator, dc-dc converter applications motor drive applications ? low drain-source on-resistance: r ds (on) = 6.5 m (typ.) ? low leakage current: i dss = 10 a (max) (v ds = 75 v) ? enhancement-model: v th = 3.0 to 4.0 v (v ds = 10 v, i d = 1 ma) absolute maximum ratings (ta = 25c) characteristics symbol rating unit drain-source voltage v dss 75 v drain-gate voltage (r gs = 20 k ) v dgr 75 v gate-source voltage v gss 20 v dc (note 1) i d 40 drain current pulse (note 1) i dp 120 a drain power dissipation (tc = 25c) p d 107 w single pulse avalanche energy (note 2) e as 164 mj avalanche current i ar 40 a repetitive avalanche energy (note 3) e ar 1.1 mj channel temperature (note 4) t ch 175 c storage temperature range (note 4) t stg ? 55 to 175 c thermal characteristics characteristics symbol max unit thermal resistance, channel to case r th (ch-c) 1.4 c/w note 1: please use devices on condition that the channel temperature is below 175c. note 2: v dd = 25 v, t ch = 25c, l = 152 h, r g = 1 , i ar = 40 a note 3: repetitive rating; pulse width limited by maximum channel temperature. note 4: 175c refers to aec-q101. note 5: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, et c.) may cause this product to decreas e in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). this transistor is an electrostatic sensit ive device. please handle with caution. unit: mm 2.54 0.25 1. gate 2. drain heat sink 3. sourse 0.4 0.1 0.4 0.1 1.6 3.0 0.2 10.0 0.3 9.5 0.2 10.0 0.3 2.35 0.1 1.4 0.1 0.76 0.1 1.1 3.5 0.2 0.1 0.1 2.76 6.8 1.0 0.3 2.34 0.25 8.0 1 2 3 jedec ? jeita ? toshiba 2-10w1a weight: 1.07 g (typ.) 1 3 2
TK40F08K3 2010-02-23 2 electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit gate leakage current i gss v gs = 20 v, v ds = 0 v ? ? 1 a drain cut-off current i dss v ds = 75 v, v gs = 0 v ? ? 10 a v (br) dss i d = 10 ma, v gs = 0 v 75 ? ? drain-source breakdown voltage v (br) dsx i d = 10 ma, v gs = ?20 v 40 ? ? v gate threshold voltage v th v ds = 10 v, i d = 1 ma 3.0 ? 4.0 v drain-source on-resistance r ds (on) v gs = 10 v, i d = 20 a ? 6.5 8.5 m input capacitance c iss ? 3600 ? reverse transfer capacitance c rss ? 350 ? output capacitance c oss v ds = 10 v, v gs = 0 v, f = 1 mhz ? 500 ? pf rise time t r ? 85 ? turn-on time t on ? 125 ? fall time t f ? 70 ? switching time turn-off time t off ? 240 ? ns total gate charge (gate-source plus gate-drain) q g ? 80 ? gate-source charge q gs1 ? 50 ? gate-drain (?miller?) charge q gd v dd 60 v, v gs = 10 v, i d = 40 a ? 30 ? nc source-drain ratings and characteristics (ta = 25c) characteristics symbol test condition min typ. max unit continuous drain reverse current (note 1) i dr ? ? ? 40 a pulse drain reverse current (note 1) i drp ? ? ? 120 a forward voltage (diode) v dsf i dr = 40 a, v gs = 0 v ? ?1.0 ? 1.2 v reverse recovery time t rr ? 38 ? ns reverse recovery charge q rr i dr = 40 a, v gs = 0 v, di dr /dt = 100 a/ s ? 50 ? nc marking duty 1%, t w = 10 s 0 v 10 v v gs r l = 1.75 v dd 35 v i d = 20 a v out 4.7 k40f08k 3 lot no. note 6 part no. (or abbreviation code) note 6: a line under a lot no. identifies the indication of product labels [[g]]/rohs compatible or [[g]]/rohs [[pb]] please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of product. the rohs is directive 2002/95/ec of the european parliament and of the council of 27 january 2003 on t he restriction of the use of certain hazardous substances in electrical and electronic equipment.
TK40F08K3 2010-02-23 3 moisture-proof packing the TK40F08K3 is packed in a moisture-proof laminated aluminum bag. precautions for transportation and storage (1) avoid excessive vibration during transportation. (2) do not toss or drop the packed dev ices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 c to 30 c and rh70% or below. perform reflow at most twice. (4) the moisture-proof bag may be stored unopened for up to 12 months at 5 c to 30 c and rh90% or below. (5) if, upon opening the bag, the moisture indicator card shows humidity of 30% or above (the color of the 30% dot has changed from blue to pink) or the expiration date has passed, the devices should be baked as follows: baking conditions: 125 c for 48 hours. since the tape materials are not heat-proof, devices should be placed on either heat-proof trays or aluminum magazines when baking. 30% the humidity indicator shows an approximate ambient humidity at 25 c. if the ambient humidity is below 30%, the co lor of all the indicator dots is blue. if, upon opening the b ag, the color of the 30% dot has changed from blue to pink, the devices should be baked before assembly.
TK40F08K3 2010-02-23 4 4 8 0 80 160 40 0 2 10 6 tc = ? 55c 100 25 120 0.8 1.2 1.6 2 0 80 120 160 40 00.4 v gs = 5 v 5.5 6 7 8 10 6.5 9 v gs = 5 v 5.5 6 6.5 9 10 0 20 40 60 80 0.4 0.6 0.8 1 0 0.2 8 v gs = 10 v 1 10 1000 1 100 100 10 8 12 16 20 0 0.4 0.6 0.8 1 0.2 04 i d = 25 a 6 13 drain-source voltage v ds (v) gate-source voltage v gs (v) v ds ? v gs common source tc = 25 pulse test drain current i d (a) r ds (on) ? i d drain-source on-resistance r ds (on) (m ) common source tc = 25 pulse test drain-source voltage v ds (v) i d ? v ds drain current i d (a) common source tc = 25 pulse test drain-source voltage v ds (v) i d ? v ds drain current i d (a) common source tc = 25 pulse test gate-source voltage v gs (v) i d ? v gs drain current i d (a) common source v ds = 10 v pulse test
TK40F08K3 2010-02-23 5 v dd = 60 v v ds v gs 30 15 80 0 40 20 040 20 0 80 120 60 10 4 8 16 12 70 30 50 60 100 0 ? 80 0 40 80 120 160 ? 40 1 2 3 4 5 200 100 1000 0.1 100 1 10 c iss c oss c rss 10000 0 ? 0.4 ? 0.8 ? 2 1 1000 100 v gs = 0, ? 1 v 1 10 5 3 ? 1.2 ? 1.6 10 20 i d = 40 a 0 20 8 12 ? 80 0 40 80 120 160 ? 40 16 4 200 10 drain power dissipation p d (w) case temperature tc (c) p d ? tc drain-source voltage v ds (v) i dr ? v ds drain reverse current i dr (a) common source tc = 25 pulse test drain-source voltage v ds (v) capacitance ? v ds capacitance c (pf) common source v gs = 0 v f = 1 mhz tc = 25c gate threshold voltage v th (v) case temperature t c (c) v th ? tc common source v ds = 10 v i d = 1 ma pulse test gate-source voltage v gs (v) dynamic input/output characteristics total gate charge q g (nc) drain-source voltage v ds (v) common source i d = 40 a tc = 25 pulse test r ds (on) ? tc drain? source on-resistance r ds (on) (m ) case temperature tc (c) common source pulse test 150 50 100 0 0 100 50 200 150
TK40F08K3 2010-02-23 6 10 100 1m 10m 100m 1 10 0.01 0.1 1 10 duty = 0.5 0.2 0.1 0.05 0.02 0.01 p dm duty = t/t r th (ch-c) = 1.4 c/w t t 100 s * 1 ms * 1000 0.1 10 0.1 1 100 0.01 10 v dss max 1 100 r th /r th (ch-c) ? t w pulse width t w (s) normalized transient thermal impedance r th (t) /r th (ch-c) single pulse e as ? t ch channel temperature (initial) tch (c) avalanche energy e as (mj) r g = 1 v dd = 25 v, l = 152 h ? ? ? ? ? ? ? ? ? ???= v dd b vdss b vdss 2 il 2 1 as test circuit waveform i ar b vdss v dd v ds ? 5 v 15 v safe operating area drain-source voltage v ds (v) drain current i d (a) i d max (continuous) i d max (pulsed) * dc operation tc = 25c *: single nonrepetitive pulse tc = 25c curves must be derated linearly with increase in temperature. e 200 100 0 25 75 150 300 200 50 125 100 175
TK40F08K3 2010-02-23 7 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collectively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality a nd reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, customers mu st also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specificati ons, the data sheets and application notes for product and the precautions and conditions set forth in the ?toshiba semiconduc tor reliability handbook? and (b) the instructio ns for the application with which the product will be used with or for. customers are solely responsible for all aspects of their own product design or applications, including but not lim ited to (a) determining the appropriateness of the use of this product in such des ign or applications; (b) evaluating and dete rmining the applicability of an y information contained in this document, or in charts, dia grams, programs, algorithms, sample application circuits, or any other referenced document s; and (c) validating all operating paramete rs for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equi pment used for automobiles, trains, ships and other transportation, traffic signalin g equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to el ectric power, and equipment used in finance-related fi elds. do not use product for unintended us e unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, us e, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpil ing or manufacturing of nucl ear, chemical, or biological weapons or missile technolog y products (mass destruction weapons). product and related softwa re and technology may be contro lled under the japanese foreign exchange and foreign trade law and the u.s. ex port administration regulations . export and re-export of product or related softw are or technology are strictly prohibit ed except in compliance with all app licable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
|
